職務簡介

1. Bumping outsource management (solder and Cu pillar bump process)
2. Bumping whole process experience, have ability for bumping abnormal troubleshooting.
3. Have package assembly experience is better.

需求學歷/科系 : 電子/電機/機械學系相關
備註事項 : 具英文能力

能力標籤

地圖